MARKLE. DAVID, A (Total 249 Patents Found)

La présente invention concerne un procédé, un appareil et un système permettant de commander la quantité de chaleur transférée sur une région de processus (30) d'une pièce à travailler (W), à partir d'une exposition à une impulsion de rayonnement (10) qui peut se présenter sous forme d'un faisc...
Chuck methods and apparatus for supporting a semiconductor substrate and maintaining it at a substantially constant background temperature even when subject to a spatially and temporally varying thermal load. Chuck includes a thermal compensating heater module having a sealed chamber containing heater elements, a wick,...
Apparatuses and methods are provided for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region. An image having an intensity sufficient to effect thermal processing of the substrate is scanned across the upper surface of the sub...
Architecture and method to transfer data in generation, display or printing high edge placement accuracy images from multiple exposures of plurality of predefined patterns, with lower edge placement accuracy. A pattern is laid out on a grid finer, or different from, grid size of image transducer pixel size overlaid by ...
Direct-write lithography apparatus and methods are disclosed in which a transducer image and an image of crossed interference fringe patterns are superimposed on a photoresist layer supported by a substrate. The transducer image has an exposure wavelength and contains bright spots, each corresponding to an activated pi...
Apparatuses and methods are provided for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region. An image having an intensity sufficient to effect thermal processing of the substrate is scanned across the upper surface of the sub...
A microlithographic stepper, employing a Half-Field Dyson projection optical system, achieves focusing of an image of a first-layer reticle pattern on a completely unpatterned reflective wafer surface by including a repetitive diffraction pattern on the reticle which has a configuration in which a particular ordinal di...
Methods and apparatus for truncating an image formed with coherent radiation. The optical relay system is adapted to form a line image at the image plane. The image is truncated by a variable aperture at or near the aperture plane conjugate to the image plane, to block progressively increasing portions of an incident c...
Disclosed is tilt-sensing means that employs a point source of alternate 1st or 2nd divergent light beams which, after passing through collimating lenses of the Half-Field Dyson projection optics of the stepper, are separately incident on and reflected from a reflective pattern disposed on the surface of a reticle and ...
The invention is directed to methods for determining the wavelength, pulse length, and other features important characteristics of radiant energy used to anneal or to activate the source and drain regions of an integrated transistor device which has been doped through implantation of dopant ions, for example. In genera...
A projection system provides a primary mirror with a thin nearly concentric shell which functions as a first mirror at shorter wavelengths for exposure purposes and functions as a second mirror surface at longer wavelengths for alignment purposes. The coating on the front surface of the shell is reflective to the expos...
Abstract of Disclosure The present invention is directed to an improvement in an alignment system for a scanning mask aligner employing a pattern on the mask or the wafer or both in the scribe lines that run in the direction of scanning, the improvement comprising a viewing system having optical grids, a system for mov...
A lithography system in which the mask or reticle, which usually carries the pattern to be printed onto a substrate, is replaced by a programmable array of binary (i.e. on/off) light valves or switches which can be programmed to replicate a portion of the pattern each time an illuminating light source is flashed. The p...
This invention includes a pin mirror arranged to receive light, preferably from a laser source. The pin mirror has a reflective surface that diffracts and reflects the received light to generate a diffraction-limited spherical wavefront. The pin mirror can reflect the wavefront in a predetermined direction by angling t...
Direct-write lithography apparatus and methods are disclosed in which a transducer image and an image of crossed interference fringe patterns are superimposed on a photoresist layer supported by a substrate. The transducer image has an exposure wavelength and contains bright spots, each corresponding to an activated pi...
Cette invention concerne un système de transfert d'une image depuis un réticule (10) vers un substrat (34), faisant appel à un réseau de lentilles ayant un champ d'image à étendue arbitraire couvrant toute la largeur dudit substrat. Ce système comprend plusieurs lentilles de Wynne Dyson (14, 16, 26, 18),...
An optical system to project an image from an illuminated object to an image plane with a selected magnification factor. This system includes a lens system having a fixed magnification factor and at least one flat plate that is optically compatible with the lens system and which when bent into a cylindrical shape varie...
Microscope apparatus and methods for imaging an object with a resolution beyond the Abbe limit are disclosed. The apparatus employs an object selectively patterned with a fluorescing material that is induced to fluoresce with one wavelength and inhibited from fluorescing with a second wavelength. Two orthogonal interfe...
Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a...
A method, apparatus and system for controlling the amount of heat transferred to a process region ( 30 ) of a workpiece (W) from exposure with a pulse of radiation ( 10 ), which may be in the form of a scanning beam (B), using a thermally induced phase switch layer ( 60 ). The apparatus of the invention is a film stack...
Chuck methods and apparatus for supporting a semiconductor substrate and maintaining it at a substantially constant background temperature even when subject to a spatially and temporally varying thermal load. Chuck includes a thermal compensating heater module having a sealed chamber containing heater elements, a wick,...
A system to transfer a pattern from a reticle to a substrate using a lens array having an arbitrarily wide image field that spans the width of the substrate. The disclosed system incorporates multiple, Wynne Dyson lenses arranged in serial pairs and staggered in position so that each dual serial Wynne Dyson lens system...
Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a...
Apparatus and method for performing laser thermal annealing (LTA) of a substrate using an annealing radiation beam that is not substantially absorbed in the substrate at room temperature. The method takes advantage of the fact that the absorption of long wavelength radiation (1 micron or greater) in some substrates, su...
Methods and apparatuses are provided for improving the intensity profile of a beam image used to process a semiconductor substrate. At least one photonic beam may be generated and manipulated to form an image having an intensity profile with an extended uniform region useful for thermally processing the surface of the ...
A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is disclosed. The chuck includes a heat sink and a thermal mass in the form of a heater module. The heater module is in thermal communication with the heat sink, but is physically sepa...
La présente invention concerne un appareil et un procédé pour effectuer un recuit thermique par laser (LTA) d'un substrat au moyen d'un faisceau de rayonnement de recuit qui n'est pas sensiblement absorbé dans le substrat à température ambiante. Ce procédé tire avantage du fait que l'absorption ...
Parallel data bus architecture, lithography system and method for substrate patterning with a high-resolution image by data generation transferring, display or printing high edge placement accuracy images from multiple exposures of plurality of predefined patterns with lower edge placement accuracy. Data bus architectu...